? semiconductor components industries, llc, 2012 may, 2012 ? rev. 4 1 publication order number: mbr5h100mfs/d mbr5h100mfs, nrvb5h100mfs switchmode power rectifiers these state ? of ? the ? art devices have the following features: features ? low power loss / high efficiency ? new package provides capability of inspection and probe after board mounting ? guardring for stress protection ? low forward voltage drop ? 175 c operating junction temperature ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these are pb ? free devices mechanical characteristics: ? case: epoxy, molded ? epoxy meets flammability rating ul 94 ? 0 @ 0.125 in. ? lead finish: 100% matte sn (tin) ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl 1 requirements maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (rated v r , t c = 150 c) i f(av) 5 a peak repetitive forward current, (rated v r , square wave, 20 khz, t c = 150 c) i frm 10 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 200 a storage temperature range t stg ? 65 to +175 c operating junction temperature t j ? 55 to +175 c voltage rate of change (rated v r ) dv/dt 10,000 v/ s unclamped inductive switching energy (10 mh inductor, non ? repetitive) e as 100 mj esd rating (human body model) 3b esd rating (machine model) c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. device package shipping ? ordering information mbr5h100mfst1g so ? 8 fl (pb ? free) 1500 / tape & reel schottky barrier rectifiers 5 amperes 100 volts http://onsemi.com 1,2,3 5,6 so ? 8 flat lead case 488aa style 2 b5h100 = specific device code a = assembly location y = year w = work week zz = lot traceability marking diagram b5h100 aywzz a a a not used c c 1 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbr5h100mfst3g so ? 8 fl (pb ? free) 5000 / tape & reel nrvb5h100mfst1g so ? 8 fl (pb ? free) 1500 / tape & reel NRVB5H100MFST3G so ? 8 fl (pb ? free) 5000 / tape & reel
mbr5h100mfs, nrvb5h100mfs http://onsemi.com 2 thermal characteristics characteristic symbol typ max unit thermal resistance, junction ? to ? case, steady state (assumes 600 mm 2 1 oz. copper bond pad, on a fr4 board) r jc ? 2.4 c/w electrical characteristics instantaneous forward voltage (note 1) (i f = 5 amps, t j = 125 c) (i f = 5 amps, t j = 25 c) v f 0.56 0.6 0.6 0.73 v instantaneous reverse current (note 1) (rated dc voltage, t j = 125 c) (rated dc voltage, t j = 25 c) i r 3 0.003 13 0.1 ma 1. pulse test: pulse width = 300 s, duty cycle 2.0%.
mbr5h100mfs, nrvb5h100mfs http://onsemi.com 3 typical characteristics figure 1. typical instantaneous forward characteristics figure 2. maximum instantaneous forward characteristics figure 3. typical reverse current characteristics figure 4. maximum reverse current characteristics v r , instantaneous reverse voltage (v) v r , instantaneous reverse voltage (v) 90 80 60 40 30 20 10 0 1.e ? 10 90 80 60 50 40 20 10 0 figure 5. typical junction capacitance figure 6. forward surge safe operating area v r , reverse voltage (v) pulse duration (ms) 90 80 60 50 30 20 10 0 10 100 1000 10,000 4.0 3.0 2.0 1.0 0 140 160 180 200 220 260 280 300 i r , instantaneous reverse current (a) c j , junction capacitance (pf) maximum forward surge current (a) ? 40 c 25 c 150 c 125 c 175 c 50 70 100 i r , instantaneous reverse current (a) 1.e ? 09 1.e ? 08 1.e ? 07 1.e ? 06 1.e ? 05 1.e ? 04 1.e ? 03 1.e ? 02 1.e+00 1.e ? 08 1.e ? 07 1.e ? 06 1.e ? 05 1.e ? 04 1.e ? 03 1.e ? 02 1.e+00 30 70 100 1.e ? 01 ? 40 c 25 c 150 c 125 c 175 c 40 70 100 240 single pulse non ? repetitive square wave 25 c ambient mounted on a minimum pad, fr4 board, 1 oz. copper pour 1.e ? 01 v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 1.8 1.6 1.0 0.8 0.6 0.4 0.2 0 0.1 1 10 i f , instantaneous forward current (a) i f , instantaneous forward current (a) 1.2 1.4 2.0 ? 40 c 25 c 150 c 125 c 175 c 1.8 1.6 1.0 0.8 0.6 0.4 0.2 0 0.1 1 10 1.2 1.4 2.0 ? 40 c 25 c 125 c 175 c
mbr5h100mfs, nrvb5h100mfs http://onsemi.com 4 typical characteristics figure 7. forward current derating over case temperature figure 8. forward current derating over ambient temperature t c , case temperature ( c) t a , ambient temperature ( c) 175 170 165 160 155 150 0 1 2 4 5 6 8 9 180 140 120 100 80 40 20 0 0 1 2 3 4 5 6 figure 9. maximum forward power dissipation figure 10. steady state junction to ambient thermal resistance i f , average rectified forward current (a) copper heat spreader area (mm 2 ) 5 4 3 2 1 0 0 1 2 3 600 500 700 400 300 200 100 0 0 20 40 60 80 100 120 140 figure 11. transient thermal response, junction to case pulse time (sec) 0.01 0.001 0.0001 0.00001 0.000001 0.01 0.1 1 10 i f , average rectified forward current (a) i f , average rectified forward current (a) p d , average forward power dissipation (w) ja ( c/w) r(t) ( c/w) 3 7 r jc = 1 c/w dc square wave 60 160 r ja = 49 c/w square wave dc t j = 175 c square wave dc 1 oz. copper pcb 2 oz. copper pcb assumes 25 c ambient temperature assumes 25 c ambient and soldered to a 600 mm 2 ? 1 oz copper pad on pcb 0.1 1 10 100 1000 50% duty cycle single pulse 20% 10% 5% 2% 1%
mbr5h100mfs, nrvb5h100mfs http://onsemi.com 5 package dimensions m 3.00 3.40 0 ??? 3.80 12 dfn5 5x6, 1.27p (so ? 8fl) case 488aa issue g notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeter. 3. dimension d1 and e1 do not include mold flash protrusions or gate burrs. 1234 top view side view bottom view d1 e1 d e 2 2 b a 0.20 c 0.20 c 2 x 2 x dim min nom millimeters a 0.90 1.00 a1 0.00 ??? b 0.33 0.41 c 0.23 0.28 d 5.15 bsc d1 4.50 4.90 d2 3.50 ??? e 6.15 bsc e1 5.50 5.80 e2 3.45 ??? e 1.27 bsc g 0.51 0.61 k 1.20 1.35 l 0.51 0.61 l1 0.05 0.17 a 0.10 c 0.10 c detail a 14 l1 e/2 8x d2 g e2 k b a 0.10 b c 0.05 c l detail a a1 e 3 x c 4 x c seating plane max 1.10 0.05 0.51 0.33 5.10 4.22 6.10 4.30 0.71 1.50 0.71 0.20 m *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.270 2x 0.750 1.000 0.905 0.475 4.530 1.530 4.560 0.495 3.200 1.330 0.965 2x 2x 3x 4x 4x pin 5 (exposed pad) style 2: pin 1. anode 2. anode 3. anode 4. no connect 5. cathode on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbr5h100mfs/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
|
